Speciality Formulations for Electronic Industry
METAL STRIPPERS
Tin Stripper : This is a NITRIC ACID BASED formulation which is used to strip electroplated Tin/Tin-Lead from copper substrate. It is very effective for continuous stripping and it is the best suited for conveyorised spray system.
Direct Use Product: BAYSTRIP EL004
Replenishable Stripper: BAYSTRIP RS005
- Single Component System. Does not involve Peroxide Addition.
- Non - Sludge Formulation. Pollution- Free and Totally a User-friendly formulation.
- High speed Stripper with Bright finish to Copper.
POLYMER STRIPPERS
RESIST STRIPPER:BAY PRS42
This is a completely a water soluble Organic Photo-Resist Stripper. This formulation contains no objectionable solid contents or solvents; this is absolutely free of Alkali hydroxides. Yet, it is quite effective in stripping and functions as a Neat stripper. This qualifies for Photo-Resist stripping of Fine-Track designs. This is suitable for stripping both totally aqueous dry-film and liquid photo-resists.
This is a high speed stripper suitable for conveyorised stripping on auto-dosing mode.
- The Resin swelling is much controlled with quick cleaning between fine line tracks; resin particles broken into a convenient size to facilitate easy filtration.
- Attack on Tin, Tin-Lead, Copper is kept at tolerance level.
- Provides good Anti-tarnish property to copper surface to enable a good inspection of Photo-resist stripping.
RESIST STRIPPER:BAY PRT10 :
A semi organic version of resist stripper suited for all kind of Resist films using any mode of usage.
SOLDER MASK REMOVER
BAYSOL EL006 / BAYSOL NX:
This formulation constitutes special resin solvents, flushing agents, decoating agents, penetrants and other ingredients to synergise the action.
The product is useful to recover rejected finished PCBs even after Curing of Solder Mask. Effective for all kind of Photoimageable Inks and UV Cured Inks.
METALCLEANERS
BAYCLEAN EL001 / BAYCLEAN RB:
It is very useful to clean copper before applying Dry Film Photo Etch Resist, before applying Dry Film Photo Imageable Solder Mask and for other type of Solder Mask, before BBT, before the application of any type of Organic Substrate Protective Coating (OSP) , for cleaning copper before Atomic Optical Inspection (AOI), before Lacquer Coating, Copper which is tarnished very badly can be cleaned with this at any stage.This formulation is very useful for print & etch process.Copper can be cleaned in presence of Tin-Lead or Tin solder without the latter being attacked.
DEVELOPER
BAY-D2:
This is completely water soluble developer chemistry suitable for Developing Dry film, Photo-imageable Solder / Etch Resists. This formulation contains no objectionable solid contents or solvents.
